TO-3P with a 3-lead through-hole footprint. The large tab is the collector; the gate and emitter are on the leads. The tab needs a heatsink — 283 W max dissipation means the thermal interface is the limiting factor in a real build. A TO-3P footprint is standard across the HB series, so if you've laid out a board for a sibling part, this one drops in without a layout change.
No last-time-buy or end-of-life notice on record. The HB series is a mature, well-established product line, so second-source availability through independent distribution is straightforward. If you're freezing a BOM, this part is not a PCN risk in the near term.