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STMicroelectronics STF3NK80Z — Discrete Semiconductors

STF3NK80Z N-Channel MOSFET, 800 V, 2.5 A, TO-220FP

MPNSTF3NK80Z
Active

STMicroelectronics SuperMESH™ STF3NK80Z, N-channel MOSFET, 800 V Vdss, 2.5 A continuous drain, 4.5 Ohm Rds(on) at 10 V, TO-220FP full-pack, -55 to 150 °C.

$2.2000Ref. price · indicative, final on quote
PackagingTO-220-3 Full Pack
RoHSROHS3 Compliant
SeriesSuperMESH™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

STF3NK80Z specifications
ParameterValue
SeriesSuperMESH™
FET typeN-Channel
MountingThrough Hole
Drain to source voltage800 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C2.5A (Tc)
Power dissipation25W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTube
Vgs±30V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3 Full Pack
Vgs(th) (Max) @ id4.5V @ 50µA
Rds on (Max) @ id, vgs4.5Ohm @ 1.25A, 10V
Gate charge (Qg) (Max) @ vgs19 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds485 pF @ 25 V

Product details

800 V breakdown — what it buys the offline supply

The STF3NK80Z: The 800 V Vdss gives enough headroom for universal-input flyback converters (85–265 VAC rectified to ~375 VDC) and auxiliary power stages in industrial equipment where the DC bus sits at 400 V or less.

Conduction loss and drive budget

Maximum on-resistance is 4.5 Ohm at 1.25 A drain current with 10 V gate drive. That is a moderate figure for an 800 V device — expect the die to run warm under continuous load, so the 25 W power dissipation limit in the TO-220FP package sets the practical operating envelope. Gate charge is 19 nC at 10 V, low enough that a standard PWM controller with a totem-pole output can drive it without an external gate driver IC.

TO-220FP — no insulator needed

The TO-220FP full-pack (fully isolated) package means the metal tab is electrically isolated from the die. No mica washer or sil-pad is required between the tab and the heatsink — the package itself provides the isolation. This simplifies assembly and reduces the thermal interface to one layer.

ROHS3 compliant.

Frequently asked questions

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