650V, 24A — Rds(on) at junction temperature, not 25°C
The STF33N65M2: Housed in the TO-220FP full-pack, the tab is fully isolated — no insulating pad needed between the device and the heatsink. Through-hole mounting suits point-of-load positions in PSUs, adapters, and lighting ballasts where the board is wave-soldered.
Gate charge and switching FOM
The ratio — a figure of merit for switching loss — keeps the driver current manageable; a 10 V gate driver sourcing 1 A charges the gate in about 42 ns, well within the edge rate of a typical half-bridge controller.
Thermal budget and SOA
Maximum junction temperature is 150°C, with 34 W power dissipation at the case. The TO-220FP's junction-to-case thermal path is higher than a standard TO-220 because of the full-pack moulding — budget the derating from the 25°C Rds(on) when the junction sits at 125°C, where the on-resistance roughly doubles.
