600 V MDmesh M6 — the high-voltage SMPS workhorse
The STF22N60DM6: The TO-220FP full-pack package provides isolation from the heatsink without an insulating pad.
The 30 W power dissipation limit at the case requires heatsink sizing to keep junction below 150°C.
20 nC gate charge — fast switching without a monster driver
Gate charge is 20 nC at 10 V. Input capacitance is 800 pF at 100 V drain-source.
Package and mounting — the TO-220FP advantage
The through-hole TO-220FP full-pack package is a rework-friendly choice. The fully molded back means no exposed metal tab, so the device is electrically isolated from the heatsink — no mica washer or sil-pad needed. This also means the mounting screw torque is less critical than with a standard TO-220. The three leads are on 2.54 mm pitch, standard for prototyping and production. If you're hand-assembling or reworking a board, the full-pack body is less prone to cracking from thermal stress than a standard TO-220 with a separate insulator.
The 150°C maximum junction temperature is standard for modern power MOSFETs, but the full-pack TO-220FP has higher thermal resistance than a standard TO-220 — so the heatsink design needs to account for that. For continuous operation at 15 A, expect a substantial heatsink or forced airflow.