500 V, 11 A N-channel in a fully isolated TO-220FP
This simplifies assembly and reduces thermal interface resistance in offline power supplies and flyback converters where the heatsink may be at chassis potential.
These figures place the STF12NM50ND in a moderate-speed class — suitable for hard-switched topologies in the 50–150 kHz range where the gate-drive current requirement stays under 150 mA. Maximum power dissipation is 25 W at case temperature, with the junction rated to 150 °C. In a typical flyback converter dissipating 10–15 W, the TO-220FP's junction-to-case thermal path through the full-pack moulding runs about 5–6 °C/W — budget a heatsink with adequate surface area to keep the junction below 125 °C for reliable operation.
STMicroelectronics lists the STF12NM50ND as obsolete. For new designs, evaluate the STF12NM50N (non-isolated TO-220) or a current FDmesh™ II or MDmesh™ series part with similar 500 V / 11 A ratings; the TO-220FP footprint is specific to the full-pack variant. Availability is limited to surplus and broker-channel inventory.
