STF10NM60N

STMicroelectronics · MDmesh™ II Series

STMicroelectronics MDmesh™ II series, N-Channel MOSFET, 600 V drain-source, 10 A continuous drain, 550 mOhm Rds(on) at 4 A, 10 V, 19 nC gate charge, TO-220-3 Full Pack (TO-220FP), -55°C to 150°C junction temperature.

STMicroelectronics STF10NM60N
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Technical specifications

STF10NM60N specifications
Parameter / AttributeSpecification / Value
SeriesMDmesh™ II
FET typeN-Channel
MountingThrough Hole
Drain to source voltage600 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C10A (Tc)
Power dissipation25W (Tc)
Operating temperature-55°C ~ 150°C (TJ)
PackageTube
Vgs±25V
TechnologyMOSFET (Metal Oxide)
CaseTO-220-3 Full Pack
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs550mOhm @ 4A, 10V
Gate charge (Qg) (Max) @ vgs19 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds540 pF @ 50 V

Technical details

600 V, 10 A N-channel — what the MDmesh II structure delivers

STF10NM60N is an N-channel 600 V, 10 A MOSFET in the TO-220 Full Pack (TO-220FP) through-hole package.

Conduction loss and switching — sizing the gate drive

On-resistance is 550 mOhm maximum at 4 A, 10 V. Gate charge is 19 nC at 10 V. Input capacitance is 540 pF at 50 V drain-source, which keeps the Miller plateau short and helps the device turn on and off cleanly.

In a real design with a heatsink, the actual dissipation limit is set by the junction-to-case thermal resistance and the ambient temperature. The TO-220FP's full-plastic construction means the thermal path is through the back of the package, not a metal tab; expect higher thermal resistance than a standard TO-220, so the heatsink needs to be sized accordingly.

STF10NM60N
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