The 150°C maximum junction allows headroom for self-heating in a compact DPAK footprint.
Supplied in Tape & Reel for automated assembly, the DPAK (TO-252) package has a metal tab on the top for heatsinking — the tab is the drain. The surface-mount footprint is standard for medium-power MOSFETs; the tab should be soldered to a copper pour on the PCB to spread heat.
