Thermal and package constraints for the board layout
The STD95N4F3: Maximum power dissipation is 110 W at case temperature (Tc), but the junction-to-ambient thermal resistance in the DPAK package means the real-world dissipation is limited by the PCB copper area on the drain tab — a 1-inch² pad on a 2-oz copper board typically handles 2-3 W continuous. Operating junction temperature range spans -55 °C to 175 °C, giving headroom for high-ambient environments like engine bays or industrial enclosures where the local air temperature reaches 85-105 °C.
Compliance and sourcing posture
ROHS3 compliant per STMicroelectronics — no restricted substances above the threshold limits, and no exemption expiry concerns for EU market placement.
