STD4N52K3

STMicroelectronics

STMicroelectronics SuperMESH3™ series, N-Channel MOSFET, 525 V Vdss, 2.5 A continuous drain current, 2.6 Ohm Rds(on) at 1.25 A, 10 V, 2 nC gate charge, DPAK (TO-252) surface-mount package.

STMicroelectronics STD4N52K3
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MOQ 1 · Tape & Reel (TR) Cut Tape (CT) · RoHS · EIA-481 · DAP/DDP · T/T

Technical specifications

STD4N52K3 specifications
Parameter / AttributeSpecification / Value
SeriesSuperMESH3™
FET typeN-Channel
MountingSurface Mount
Drain to source voltage525 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C2.5A (Tc)
Power dissipation45W (Tc)
Operating temperature150°C (TJ)
PackageTape & Reel (TR) Cut Tape (CT)
Vgs±30V
TechnologyMOSFET (Metal Oxide)
CaseTO-252-3, DPak (2 Leads + Tab), SC-63
Vgs(th) (Max) @ id4.5V @ 50µA
Rds on (Max) @ id, vgs2.6Ohm @ 1.25A, 10V
Gate charge (Qg) (Max) @ vgs2 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds334 pF @ 100 V

Technical details

The STD4N52K3: The gate charge is 2 nC at 10 V. The DPAK (TO-252) surface-mount package fits compact PCB layouts where a 45 W power dissipation budget is adequate with proper thermal management.

Switching performance and drive requirements

Gate charge is 2 nC at 10 V. The recommended drive voltage for achieving the rated Rds(on) is 10 V.

Thermal and mechanical design notes

Maximum junction temperature is 150°C, and the device is rated for 45 W power dissipation at the case.

STD4N52K3
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