Package and footprint reality
The 12-TQFN with a 1.7x2 mm body is a fine-pitch, no-lead package. The exposed pad must be soldered to a copper plane on the PCB to carry the heat from the 400 mA output at high step-down ratios. The supplier device package is listed as 12-TQFN (1.7x2).
Lifecycle and sourcing posture
The ST1PS03A1QTR carries an Active lifecycle status with ROHS3 compliance.
