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STMicroelectronics M24512-RDW6TP — Microcontrollers & Processors (MCU / MPU / DSP)

M24512-RDW6TP 512Kbit I²C EEPROM, 1 MHz, 8-TSSOP

MPNM24512-RDW6TP
End of Life

STMicroelectronics M24512-RDW6TP serial EEPROM, 512Kbit, I²C interface, 1 MHz clock, 500 ns access, 1.8-5.5 V supply, 8-TSSOP package, Tape & Reel.

$0.83Ref. price · indicative, final on quote
Packaging8-TSSOP (0.173", 4.40mm Width)
RoHSROHS3 Compliant
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

M24512-RDW6TP specifications
ParameterValue
Memory typeNon-Volatile
MountingSurface Mount
Supply voltage1.8V ~ 5.5V
Clock frequency1 MHz
Memory interfaceI²C
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
TechnologyEEPROM
Access time500 ns
Memory size512Kbit
Memory formatEEPROM
Case8-TSSOP (0.173\", 4.40mm Width)
Memory organization64K x 8
Write cycle time - word, page5ms

Product details

512Kbit I²C EEPROM for parametric storage and firmware patches

The M24512-RDW6TP is a 512Kbit serial EEPROM organized as 64K x 8 bits, communicating over an I²C bus at up to 1 MHz. It stores calibration constants, device configuration, boot parameters, or small firmware patches that need field updates without reprogramming the main flash.

500 ns access, 5 ms page write — timing budget for the firmware loop

Random read access is 500 ns max after the address byte, which sets the ceiling on back-to-back sequential reads across the I²C bus. The 1 MHz clock rate yields a raw 125 kbyte/s throughput on the bus, but the actual read rate is lower once the EEPROM's internal access time and the master's acknowledge polling are factored in. Page write completes in 5 ms typical — budget this into the firmware update routine: a full 64K x 8 rewrite takes roughly 320 ms if written page-by-page with no bus contention. The write cycle time is the same whether writing one byte or a full page, so burst writes are more efficient.

8-TSSOP footprint and rework considerations

Housed in an 8-lead TSSOP (4.40 mm body width, 0.65 mm pitch), the package is small enough for dense layouts but still hand-reworkable with a hot-air station. The 0.65 mm pitch means the solder paste stencil aperture should be sized to avoid bridging between adjacent pins — a 0.30 mm stencil thickness with 1:1 aperture-to-pad ratio is a common starting point. Pin 1 is marked by a dot on the package top and a chamfered corner — both are visible under magnification after reflow, so orientation is clear even if the board silk screen is faint. The low pin count and wide lead span (relative to the body) make it forgiving for hand placement.

Active lifecycle and compliance documentation

No minimum order quantity restrictions apply beyond the reel increment.

Frequently asked questions

How do I get current pricing and availability for M24512-RDW6TP?

Submit an RFQ through the storefront. The part is active and RoHS3 compliant, sourced through independent distribution channels.