Sensor fusion in a 2.5x3 mm footprint
The LSM6DSV16BXTR is a 6-axis iNEMO inertial module from STMicroelectronics combining a 3D accelerometer, 3D gyroscope, and temperature sensor in a single 14-LGA (2.5x3) package. It belongs to the LSM6DSV family, which targets always-on sensor fusion applications where power and board space are tight. What sets this variant apart is the digital interface set: it supports I²C, I3C℠, and SPI. I3C brings a higher data rate and lower power than I²C while keeping backward compatibility — useful when the host SoC already has an I3C controller and you want to avoid a separate SPI bus for the gyro data stream.
Industrial temperature grade and board-fit
Surface-mount assembly is standard; the LGA footprint is compatible with both leaded and lead-free reflow profiles. No underfill is required for most applications, but if the board sees repetitive shock above 10,000 g, a corner-staking epoxy is worth evaluating.