8-channel isolation in a 20-QSOP footprint
The SI8384P-IU: Capacitive coupling technology delivers 2500 Vrms isolation with 3.9 ns typical rise and 3.7 ns fall times, keeping signal edges clean at the rated 2 Mbps data rate.
Industrial temperature range and supply flexibility
The 20-QSOP footprint (0.025-inch lead pitch) demands a controlled-impedance layout for the isolation barrier; the capacitive coupler's common-mode transient immunity is implicit in the 3.9 ns edge rate, but the board designer should keep the ground plane split cleanly under the package.