System basis chip with integrated CAN and LIN for automotive ECUs
The NXP UJA1132HW/FD/3V/0Y is an automotive-grade system basis chip (SBC) that integrates a buck/boost DC-DC converter, a high-speed CAN transceiver, and two LIN transceivers into a single package. It is qualified to AEC-Q100 and operates across the full automotive temperature range of -40°C to 125°C, making it suitable for under-hood and engine-bay electronic control units (ECUs) such as body controllers, gateway modules, and smart actuator interfaces. The supply range spans 2V to 28V, which covers both 12V and 24V automotive electrical systems without external pre-regulation. With a typical supply current of 2.8mA in normal operation, this SBC is designed for always-on modules where quiescent draw must stay low to avoid draining the vehicle battery during ignition-off periods.
2V to 28V supply — 12V and 24V system ready
The wide 2V to 28V input range means this part handles 12V passenger-vehicle electrical systems and 24V truck/bus architectures without a separate pre-regulator. The buck/boost converter maintains a stable output even when the battery voltage dips during cold-crank or rises during load-dump transients within the rated range. For a 24V automotive application, the 28V maximum supply provides enough headroom for nominal 24V operation plus the usual transient peaks. No external clamping or series regulator is required as long as the transient stays under 28V.
Active production, no obsolescence risk for new designs
ROHS3 compliance is confirmed, so the part meets current European and global restriction-of-hazardous-substances requirements without a waiver or exemption.
48-HTQFP exposed pad — thermal and layout considerations
The package with exposed pad requires a thermal land on the PCB to dissipate heat from the integrated buck/boost converter. The exposed pad must be soldered to a copper pour connected to the ground plane; the datasheet's recommended footprint and stencil aperture should be followed to avoid solder voids that degrade thermal performance. Surface-mount assembly is standard for this package class. The exposed pad adds a center-ground connection that also improves EMI by reducing the ground-return inductance of the switching converter.