Package and mounting
16-SSOP with a 5.30 mm body width and 0.209" pitch. That's a fine-pitch but hand-reworkable package if you've got a decent hot-air station and flux. The thermal mass is low, so it doesn't need preheat for removal. Just watch the adjacent passives; they'll shift if you overshoot the airflow. ROHS3 compliant, so lead-free solder profile, but the package itself is robust to a couple of reflow cycles.
Lifecycle and sourcing posture
Listed as Active — no end-of-life notice, no last-time-buy pressure. That means you can qualify it into a new production BOM without worrying about a sudden obsolescence-driven redesign. The ROHS3 compliance covers current EU and UK directives, so no exemption paperwork needed.