What this Ethernet switch brings to an automotive board
The NXP SJA1105QELY is an automotive-grade Ethernet switch controlled over SPI, built for in-vehicle networks that need deterministic switching under IEEE 802.3. The 159-ball LFBGA (12x12 mm) footprint keeps the board area tight, and the supply rail accepts anything from 1.65V to 3.6V, letting it run off a 1.8V or 3.3V ECU rail without an extra regulator.
Why the automotive grade matters for your BOM
AEC-Q100 is the gate for any semiconductor that goes into a production vehicle. The 3.5 mA typical supply current is low enough that it does not stress the always-on rail in a sleep-capable ECU.
Package and layout: the 159-LFBGA reality
The 159-LFBGA measures 12x12 mm with a 0.8 mm ball pitch (typical for this ball count). That pitch is fine for a standard 4-layer automotive PCB with via-in-pad if you want to route all signals on inner layers. No exposed thermal pad to worry about — the BGA itself conducts heat through the balls to the board plane. Reflow profile follows standard lead-free (RoHS3 compliant per) with MSL handling typical of BGA packages; the reel or cut-tape option lets you order production reels or a few pieces for a prototype run.
Lifecycle and sourcing posture
NXP lists the SJA1105QELY as an active product. The part is RoHS3 compliant.