Package and layout — 32-HVQFN with exposed pad
The 32-HVQFN (5x5 mm) package with exposed pad requires a thermal via array under the pad for both heat dissipation and ground return. The pad is electrically connected to GND. The Tape & Reel and Cut Tape options mean the part is available in production-friendly reel quantities for pick-and-place, or in smaller cut-tape lengths for prototyping and low-volume builds.
Lifecycle and compliance
The SC16IS752IBS,128 is listed as Active and ROHS3 compliant. The ROHS3 status means it meets the latest EU restriction levels, including exemptions for lead in solder joints — no special handling or exemption expiry tracking needed.
