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NXP Semiconductors MRFE6VS25GNR1

MRFE6VS25GNR1 RF MOSFET LDMOS, 25W, 512MHz, TO-270-2 GULL

MPNMRFE6VS25GNR1
End of Life

NXP MRFE6VS25GNR1 LDMOS RF power transistor, 25W output at 512MHz, 25.4dB gain, 50V test supply, 133V rated voltage, TO-270-2 GULL surface-mount package, ROHS3 compliant.

$36.82Ref. price · indicative, final on quote
PackagingTO-270BA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MRFE6VS25GNR1 Technical Specifications
ParameterValue
Mounting typeSurface Mount
FET typeLDMOS
Voltage - test50 V
Voltage - rated133 V
Current - test10 mA
Power - output25W
Frequency512MHz
Gain25.4dB
PackageTape & Reel (TR); Cut Tape (CT)
CaseTO-270BA

Product details

RF power LDMOS for 512 MHz band

The NXP MRFE6VS25GNR1 is an LDMOS RF power transistor designed for 512 MHz operation, delivering 25 W output with 25.4 dB gain at a 50 V test supply. The 133 V rated drain-source breakdown gives headroom for load mismatch and high-VSWR conditions common in RF power amplifier output stages. The TO-270-2 GULL package is a surface-mount, gull-wing leaded case with a large backside source tab for thermal conduction to the PCB ground plane. The 10 mA test current is typical for small-signal gain characterization; actual bias current in class-AB operation will be higher.

Gain and power — what they mean for the PA stage

The 133 V rated voltage means the device can survive transient overvoltage events up to that peak without avalanche failure, provided the thermal limit is respected. This is a ruggedness spec, not a continuous operating point.

Package and mounting — TO-270-2 GULL

The TO-270-2 GULL surface-mount package has two gull-wing leads plus a large source tab on the bottom. The tab must be soldered to a thermal-via array under the part to keep the junction temperature within limits at 25 W continuous output. The package footprint is smaller than a flanged bolt-down TO-272, saving board area in dense PA arrays. Cut Tape (CT) and Tape & Reel (TR) options are available for different assembly volumes. The surface-mount format suits automated pick-and-place lines, though the large tab may need a longer reflow profile for complete solder wetting.

Lifecycle and compliance

The MRFE6VS25GNR1 is listed as Active in production status and ROHS3 compliant. No end-of-life notification or last-time-buy window has been published. This is a current-design-in part for new RF power amplifier projects, not a phase-out risk.

Frequently asked questions

Is MRFE6VS25GNR1 obsolete?

No, the MRFE6VS25GNR1 is Active in production status. No discontinuation notice has been issued, and it remains a current-design-in part for new RF power amplifier projects.

What is MRFE6VS25GNR1's gain and power output?

The device delivers 25.4 dB gain and 25 W output at 512 MHz when tested at 50 V supply and 10 mA quiescent current. These are the headline small-signal and saturated power ratings for the part.

What are the typical applications for MRFE6VS25GNR1?

This LDMOS transistor is suited for RF power amplifier stages in ISM-band (industrial, scientific, medical) equipment at 512 MHz, UHF broadcast transmitters, and land-mobile radio base stations. The 50 V supply rail and 25 W output level fit medium-power PA designs where efficiency and gain are critical.