NXP Kinetis KL2 series, 32-bit ARM Cortex-M0+ MCU, 48MHz, 64KB Flash, 16KB SRAM, USB OTG, I²C/SPI/UART/FlexIO, 8x16b ADC, 24 I/O, 1.71-3.6V, -40 to 105°C, 32-QFN (5x5) exposed pad, tray.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | Kinetis KL2 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.71V ~ 3.6V |
| Operating temperature | -40°C ~ 105°C (TA) |
| Speed | 48MHz |
| Package | Tray |
| RAM size | 16K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | DMA, I²S, PWM, WDT |
| Connectivity | I²C, FlexIO, SPI, UART/USART, USB |
| Number of i (O) | 24 |
| Core processor | ARM® Cortex®-M0+ |
| Case | 32-UFQFN Exposed Pad |
| Data converters | A/D 8x16b |
| Program memory size | 64KB (64K x 8) |
Frequently asked questions
Is the MKL27Z64VFM4 active and ROHS compliant?
Yes — the product status is Active and the part is ROHS3 Compliant. The tray packaging is standard at this order code.
Does the 32-QFN exposed pad require thermal vias to the ground plane for 105°C ambient operation?
Yes — the exposed pad is the primary thermal path out of the package. Without a soldered ground plane connection and thermal vias, junction temperature will exceed rating at 105°C ambient when running at 48MHz. Treat the pad as a mandatory mechanical and thermal feature, not optional.
Is tape-and-reel packaging available instead of tray for panel-build quantities of 25–100 units?
The standard packaging for this order code is tray. Tape-and-reel availability at the quantities you need should be confirmed against the specific date code and distributor stock position via RFQ — tray is the listed packaging type in the source data.