NXP Kinetis K20 series, ARM Cortex-M4 32-bit MCU running at 120MHz, 512KB Flash / 128KB RAM / 16KB EEPROM, 1.71V to 3.6V supply, 100 I/O, 144-LBGA (13×13mm) package, -40°C to 105°C operating temperature, tray.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | Kinetis K20 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.71V ~ 3.6V |
| Operating temperature | -40°C ~ 105°C (TA) |
| Speed | 120MHz |
| Package | Tray |
| RAM size | 128K x 8 |
| Core size | 32-Bit Single-Core |
| EEPROM size | 16K x 8 |
| Peripherals | DMA, I²S, LVD, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, I²C, IrDA, SD, SPI, UART/USART, USB, USB OTG |
| Number of i (O) | 100 |
| Core processor | ARM® Cortex®-M4 |
| Case | 144-LBGA |
| Data converters | A/D 58x16b; D/A 2x12b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
Does the integrated USB OTG on the MK20FX512VMD12 support a real-time Ethernet profile like Profinet IRT or EtherNet/IP without an external MAC/PHY?
The connectivity suite on this variant includes USB OTG, UART/USART, SPI, CAN, and SD — no native Ethernet MAC/PHY is integrated on the K20 silicon. A Profinet IRT or EtherNet/IP adapter implementation requires an external Ethernet MAC/PHY chip; the on-chip SPI and USB OTG interfaces are available as host buses for external ethernet controllers but do not provide the real-time MAC layer internally.
What is the minimum thermal-via clearance and routing rule for the 144-LBGA 0.8mm ball pitch in a double-sided panel layout?
The MK20FX512VMD12 is supplied in tray quantities only and the 144-LBGA (13×13mm, 0.8mm pitch) thermal and routing geometry is defined in the NXP datasheet package section — IPC Class 2 fabrication tolerances for this ball pitch typically require a minimum 0.35mm trace width and 0.2mm clearance in HDI-compatible stack-ups, but the specific design rule depends on your board fabricator's capability set and the layer count available. Our desk does not hold the fab-specific DFM rule file; a DFM review against your panel layout is required before order release.