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NXP USA Inc. MIMXRT685SFFOB — Microcontrollers & Processors (MCU / MPU / DSP)

NXP MIMXRT685SFFOB ARM Cortex-M33 300MHz MCU 249-FOWLP

MPNMIMXRT685SFFOB
Active

NXP, RT-600 series, 32-bit dual-core ARM Cortex-M33 crossover MCU at 300MHz, 4.5M x 8 RAM, external program memory, 147 I/O, USB2.0 OTG, 1.71V to 3.6V supply, -20°C to 85°C operating ambient, 249-FOWLP (7x7mm) surface-mount tray.

$29.2800Ref. price · indicative, final on quote
Packaging249-WFBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MIMXRT685SFFOB Technical Specifications
ParameterValue
SeriesRT-600
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeExternal Program Memory
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-20°C~85°C(TA)
Speed300MHz
PackageTray
RAM size4.5M x 8
Core size32-Bit Dual-Core
PeripheralsBrown-out Detect/Reset, DMA, POR, PWM, WDT
ConnectivityEBI/EMI, I²C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG
Number of i (O)147
Core processorARM® Cortex®-M33
Case249-WFBGA
Data convertersA/D 12x12b

Frequently asked questions

Can I run this part on a 3.3V rail without an LDO?

Yes. The supply range of 1.71V to 3.6V accepts 3.3V directly, and the 147 GPIO banks are 3.3V native. The USB OTG PHY on VBUS is a separate 5V domain — that needs its own 3.3V LDO from the bus, not from the core 3.3V rail.

Does the external program memory requirement mean I must add SPI flash to my BOM?

Yes. The MIMXRT685SFFOB boots from FlexSPI — it has no internal flash. You need a matched SPI or Octal Flash device and the correct boot configuration set in the OTP fuses. There is no onboard flash option to populate to reduce the BOM; a different RT600 sub-variant would be required for that.

Is the -20°C to 85°C rating sufficient for a sealed cabinet with no active cooling?

That depends on the actual cabinet interior temperature under your worst-case ambient. At 85°C TA the part is at its upper ambient limit — if your cabinet runs hotter than that, or if the thermal resistance of your board assembly pushes junction temperature above the NXP derating curve, you need the extended-temperature RT685 variant rated for higher ambient.