NXP LPC5526JBD100K — ARM Cortex-M33 150MHz MCU, 256KB Flash, 100HLQFP
NXP LPC5526JBD100K, LPC552x series, ARM Cortex-M33 32-bit single-core at 150MHz, 256KB flash / 144KB SRAM, USB OTG, 10-ch 16-bit ADC, 64 I/O, 1.8V–3.6V supply, -40°C to 105°C, 100-HLQFP (14×14mm) exposed pad, tray.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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Specifications
| Parameter | Value |
|---|---|
| Series | LPC552x |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.8V ~ 3.6V |
| Operating temperature | -40°C~105°C(TA) |
| Speed | 150MHz |
| Package | Tray |
| RAM size | 144K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT |
| Connectivity | Flexcomm, I²C, MMC/SD/SDIO, SPI, UART/USART, USB |
| Number of i (O) | 64 |
| Core processor | ARM® Cortex®-M33 |
| Case | 100-LQFP Exposed Pad |
| Data converters | A/D 10x16b |
| Program memory size | 256KB (256K x 8) |
Frequently asked questions
Is the LPC5526JBD100K active and recommended for new industrial designs, or is it on EOL or allocation watch?
Active with no PCN or EOL notice in the current ledger — NXP lists the LPC552x series as in production and suitable for new designs.
Does the 100HLQFP exposed pad require special thermal management beyond standard SMT paste and reflow?
The 100-HLQFP thermal pad must be soldered to a PCB ground plane with through-hole vias for thermal relief; this is standard practice for the 100HLQFP in industrial temperature-rated assemblies. A thermal design review is advisable when the part operates at the upper end of its 105°C ambient rating under full peripheral load.
What supply voltage does the LPC5526JBD100K require?
1.8V to 3.6V single-supply operation — designed for a standard 3.3V rail. The 1.8V lower bound gives headroom against brownout and voltage droop on industrial 3.3V rails feeding motor-drive or power-supply-adjacent control cards.