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NXP USA Inc. LPC54114J256UK49Z — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC54114J256UK49Z — 32-bit Dual-Core ARM MCU, 256KB Flash, 49-WLCSP

MPNLPC54114J256UK49Z
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NXP LPC54100 series, ARM Cortex-M4/M0+ dual-core MCU @100MHz, 256KB Flash / 192KB RAM, 39 I/O, USB/I2C/SPI/UART, 1.62–3.6V, -40°C to 105°C, 49-UFBGA WLCSP (3.44×3.44mm).

$7.0400Ref. price · indicative, final on quote
Packaging49-UFBGA, WLCSP
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

LPC54114J256UK49Z Technical Specifications
ParameterValue
SeriesLPC54100
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.62V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed100MHz
PackageTape & Reel (TR) Cut Tape (CT)
RAM size192K x 8
Core size32-Bit Dual-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
ConnectivityI²C, SPI, UART/USART, USB
Number of i (O)39
Core processorARM® Cortex®-M4/M0+
Case49-UFBGA, WLCSP
Data convertersA/D 12x12b
Program memory size256KB (256K x 8)

Frequently asked questions

Can the LPC54114J256UK49Z be hot-plugged on a USB rail without external POR circuitry?

The chip carries an internal brown-out detect/reset and POR block per the spec table, but the sequencing threshold and response time relative to USB VBUS detection are documented in the NXP device errata and datasheet — not in the spec table. The brown-out reset is present; whether it asserts before USB enumeration failure on a marginal rail is a timing condition to verify against your USB host compliance requirement before dropping the external supervisor.

What is the package rework risk for the 49-WLCSP?

The 49-ball WLCSP at 3.44×3.44mm requires precision reflow tooling — it is not a hand-solder part. Moisture sensitivity is higher than leaded packages; verify MSL rating and dry-bake requirements with your assembler before any rework. Board respin triggered by package mismatch costs more than the MCU delta, so confirm ball pitch and pin-map against the NXP package specification before layout lock.