NXP LPC2100 series ARM7 MCU; 60MHz clock, 512KB FLASH / 32KB RAM, 47 I/O, five serial interfaces (SPI/SSP/I2C/USART), one 8-channel 10-bit ADC plus one 10-bit DAC; 3.3V supply, -40 to 85°C industrial temp grade; ROHS3 Active; 64-LQFP (10x10mm, 0.5mm pitch).
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | LPC2100 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 3V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 60MHz |
| Package | Bulk |
| RAM size | 32K x 8 |
| Core size | 16/32-Bit |
| Peripherals | Brown-out Detect/Reset, POR, PWM, WDT |
| Connectivity | I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 47 |
| Core processor | ARM7® |
| Case | 64-LQFP |
| Data converters | A/D 8x10b; D/A 1x10b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
For a closed-panel ambient of 60–70°C, does the -40°C to 85°C rating require derating?
The 85°C absolute maximum leaves limited junction-temperature margin at 60–70°C ambient, particularly if the 64-LQFP has no thermal vias under the ground pad. The thermal constraint is real; clock derating or explicit thermal relief is a practical step, not a theoretical one.
What is the minimum order quantity and packaging format?
The standard delivery format is bulk. Minimum order quantity and partial reel availability depend on the distributor; verify pack size before splitting a reel for prototype quantities.
Does the 64-LQFP (10x10mm, 0.5mm pitch) require special hot-air rework profiling?
The 64-LQFP at 0.5mm pitch is a standard reworkable package — consistent nozzle temperature and flux prework will get the part off without lifting pads. The ground pad under the package is the thermal anchor; preheat the board to reduce thermal gradient stress before reflowing.