NXP LPC2103 ARM7® MCU, 70MHz, 32KB Flash, 8KB RAM, 8x10b ADC, 32 GPIO, I²C/SPI/SSP/UART, 1.65-3.6V, -40 to 85°C, 48-HVQFN exposed pad, bulk tray.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | LPC2100 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 1.65V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 70MHz |
| Package | Bulk |
| RAM size | 8K x 8 |
| Core size | 16/32-Bit |
| Peripherals | POR, PWM, WDT |
| Connectivity | I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 32 |
| Core processor | ARM7® |
| Case | 48-VFQFN Exposed Pad |
| Data converters | A/D 8x10b |
| Program memory size | 32KB (32K x 8) |
Frequently asked questions
How much Flash and RAM does the LPC2103FHN48H/6518 have?
32KB of Flash and 8KB of SRAM. The 32KB ceiling is the firmware scope limit — designs exceeding 30KB compiled code should verify build-map headroom before BOM commit.
What connectivity does the 48-HVQFN package expose?
All 32 GPIO pins are available, with I²C, Microwire, SPI, SSI, SSP, and UART/USART on the peripheral list. The 8-channel 10-bit ADC is muxed onto the GPIO pool — no dedicated ADC pin conflict with the digital interfaces in the standard pin multiplexing scheme.
What voltage and speed does it run at?
70MHz system clock from a 1.65-3.6V single supply. The narrow voltage window means a regulated 3.3V rail is required — unregulated 5V is not acceptable for this part.
Does this part come in tape-and-reel or tray packaging?
The /6518 suffix denotes the bulk tray variant; it ships in tubes or waffle packs, not tape-and-reel. Confirm the MSL rating against the NXP datasheet before dry-bake planning on incoming inspection.