NXP LPC1315FHN33,551 — ARM Cortex-M3 72MHz MCU, 32KB Flash, 32-HVQFN
MPNLPC1315FHN33,551
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NXP LPC13xx series ARM Cortex-M3 MCU, LPC1315FHN33,551, 72MHz, 32KB Flash, 8KB RAM, 2K EEPROM, 28 I/O, 8x12b ADC, I²C/SPI/UART, 2V–3.6V, -40°C to 85°C, 32-HVQFN exposed pad, ROHS3, Tray.
$7.0200Ref. price · indicative, final on quote
Packaging32-VQFN Exposed Pad
StockContact for availability
MOQ1 pcs
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Specifications
| Parameter | Value |
|---|---|
| Series | LPC13xx |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 2V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 72MHz |
| Package | Tray |
| RAM size | 8K x 8 |
| Core size | 32-Bit Single-Core |
| EEPROM size | 2K x 8 |
| Peripherals | Brown-out Detect/Reset, POR, WDT |
| Connectivity | I²C, Microwire, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 28 |
| Core processor | ARM® Cortex®-M3 |
| Case | 32-VQFN Exposed Pad |
| Data converters | A/D 8x12b |
| Program memory size | 32KB (32K x 8) |
Frequently asked questions
Does the 32-HVQFN exposed pad require special routing, and does the -40°C to 85°C rating hold at full 72MHz clock with the ADC running?
The exposed pad is load-bearing — it must be soldered to a routed thermal pad with a through-via array to the ground plane. The -40°C to 85°C rating is the ambient ceiling; thermal simulation at 72MHz with continuous ADC conversion is required for enclosed-panel or DIN-rail enclosure deployments to confirm the actual local ambient stays within limit.