Triple buffer for mixed-voltage logic translation
The Nexperia 74HC3G34GD,125 is a triple non-inverting buffer from the 74HC family, each channel a single-bit push-pull stage. The 8-XSON package (2x3 mm) is a small footprint for space-constrained layouts, and the surface-mount assembly suits automated pick-and-place. For higher fan-out, plan on buffering through a second stage.
Package and footprint considerations
The 8-XFDFN package (supplier device package 8-XSON, 2x3 mm) is a leadless plastic package with exposed pads. The PCB land pattern should match the Nexperia recommended footprint for XSON2x3 — the centre pad is not a thermal slug but a mechanical tie; no thermal via is required. Reflow profile per JEDEC MSL 1, no bake needed if the moisture barrier bag is intact.