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NXP Semiconductors 74AUP2G17GF,132 — Logic ICs

74AUP2G17GF,132 Buffer, Non-Inverting, 0.8V-3.6V, 6-XSON

MPN74AUP2G17GF,132
End of Life

NXP 74AUP series, 74AUP2G17GF,132, Buffer, Non-Inverting, Schmitt Trigger Input, Push-Pull Output, 0.8V ~ 3.6V supply, 4mA output, -40°C ~ 125°C, 6-XSON (1x1 mm) package.

$0.17Ref. price · indicative, final on quote
Packaging6-XFDFN
StockContact for availability
MOQ1 pcs
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Specifications

74AUP2G17GF,132 Technical Specifications
ParameterValue
Series74AUP
Input typeSchmitt Trigger
Logic typeBuffer, Non-Inverting
Output typePush-Pull
Mounting typeSurface Mount
Voltage0.8V ~ 3.6V
Current - output high, low4mA, 4mA
Operating temperature-40°C ~ 125°C (TA)
PackageBulk
Case6-XFDFN
Number of elements2
Number of bits per element1

Product details

Ultra-low-power dual buffer for space-constrained, battery-operated designs

The NXP 74AUP2G17GF,132 is a dual non-inverting buffer with Schmitt-trigger inputs from the 74AUP family — NXP's lowest-power CMOS logic series. The 6-XSON package measures just 1x1 mm, making it a fit for wearable, IoT sensor node, and portable medical designs where board area and battery life are the constraints.

Schmitt-trigger inputs — noise immunity for slow or noisy signals

The Schmitt-trigger input on each buffer provides hysteresis, cleaning up slow edges from RC-delayed signals, mechanical switches, or sensor outputs. In an industrial or mixed-signal environment, this prevents false triggering from coupled noise or ground bounce that a standard CMOS input would pass through.

Supply voltage range — runs directly from a single Li-ion cell

The 0.8V to 3.6V supply range covers the full discharge curve of a lithium-ion battery (3.6V down to ~3.0V nominal, and further with a boost). It also interfaces directly with 1.2V, 1.8V, and 3.3V logic families without level translation. For a 1.8V MCU I/O, this buffer can clean and re-drive a signal to a peripheral at the same voltage.

Temperature grade — rated for automotive and industrial environments

The 125°C upper limit covers engine-compartment ambient and high-density PCB hotspots without derating.

Package and footprint — 6-XSON (1x1 mm)

The 6-XSON (1x1 mm) package is a leadless plastic package with a 0.35 mm pitch. It requires a fine-pitch PCB layout and a solder-paste stencil designed for small land patterns. The small size suits multi-layer boards in wearables and sensor modules where every square millimeter counts.

Frequently asked questions

Is 74AUP2G17GF,132 RoHS compliant?

Yes, it is ROHS3 compliant.

What is the equivalent part for 74AUP2G17GF,132?

This is a unique package variant (6-XSON) in the 74AUP series. A pin-compatible equivalent in a larger package (e.g., 6-TSSOP) would be a different order code; check the NXP 74AUP2G17 family for alternate packages.