NXP RT500 series, MIMXRT595SFFOC, ARM Cortex-M33 32-bit dual-core at 200MHz, 5MB RAM, 136 I/O, USB2.0 OTG, 12-channel 12-bit ADC, external program memory, -20°C to 70°C, 249-FOWLP tray.
$30.5600Ref. price · indicative, final on quote
Packaging249-WFBGA
StockContact for availability
MOQ1 pcs
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | RT500 |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | External Program Memory |
| Operating temperature | -20°C ~ 70°C (TA) |
| Speed | 200MHz |
| Package | Tray |
| RAM size | 5M x 8 |
| Core size | 32-Bit Dual-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, LCD, POR, PWM, WDT |
| Connectivity | EBI/EMI, I2C, MMC/SD/SDIO, SPDIF, SPI, UART/USART, USB2.0 OTG |
| Number of i (O) | 136 |
| Core processor | ARM® Cortex®-M33 |
| Case | 249-WFBGA |
| Data converters | A/D 12x12b |
Frequently asked questions
Is the 249-FOWLP package reworkable compared to LQFP peers?
The 249-ball FOWLP at 7x7 mm requires tighter coplanarity and via-in-pad handling than standard LQFP rework. Panel builders should validate their reflow profile and rework station capability against NXP's package handling guidance before qualifying this part as an alternate to an LQFP-based MCU on the approved list.