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NXP USA Inc. LPC54S018J4MET180E — Microcontrollers & Processors (MCU / MPU / DSP)

NXP LPC54S018J4MET180E — 180MHz ARM Cortex-M4 MCU, 4MB Flash, 180-TFBGA

MPNLPC54S018J4MET180E
Active

NXP LPC540xx ARM Cortex-M4F MCU, 180MHz, 4MB Flash, 360KB SRAM, 137 I/O, Ethernet/CANbus/USB/SPIFI, 12×12b ADC, 1.71–3.6V, -40°C to 105°C, 180-TFBGA.

$13.5000Ref. price · indicative, final on quote
Packaging180-TFBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

LPC54S018J4MET180E Technical Specifications
ParameterValue
SeriesLPC540xx
Mounting typeSurface Mount
Oscillator typeInternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))1.71V ~ 3.6V
Operating temperature-40°C ~ 105°C (TA)
Speed180MHz
PackageTray
RAM size360K x 8
Core size32-Bit Single-Core
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT
ConnectivityCANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SmartCard, SPI, SPIFI, UART/USART, USB
Number of i (O)137
Core processorARM® Cortex®-M4
Case180-TFBGA
Data convertersA/D 12x12b
Program memory size4MB (4M x 8)

Frequently asked questions

Is the LPC54S018J4MET180E active or in end-of-life status?

It is listed as Active with ROHS3 compliance — no NRND or EOL notice appears in the current ledger. Monitor NXP PCN channels for any formal change notices before building large buffer stock.

What is the package, and is it hand-solderable?

180-TFBGA (12×12mm) in a tray pack — a BGA package requiring reflow or BGA rework equipment. It is not hand-solderable, and footprint compatibility with other LPC540xx TFBGA variants must be verified pin-by-pin before assuming drop-in compatibility.

What is the typical application for this part?

Industrial embedded control cards, edge-compute nodes, and sensor-fusion modules that require 4MB of on-chip Flash, Ethernet/CANbus connectivity, and the -40°C to 105°C industrial temperature grade — typically deployed inside control enclosures rather than field-exposed endpoints.