NXP LPC1812JET100E MCU 180MHz ARM Cortex-M3 512KB Flash Industrial
MPNLPC1812JET100E
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NXP LPC1812JET100E, LPC18xx series, ARM Cortex-M3 32-bit single-core at 180MHz, 512KB Flash, 104KB SRAM, 16KB EEPROM, CANbus/USART/SPI/SD, 49 I/O, 100-TFBGA, 2.2-3.6V, -40 to 105°C.
$14.8300Ref. price · indicative, final on quote
Packaging100-TFBGA
StockContact for availability
MOQ1 pcs
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | LPC18xx |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 2.2V ~ 3.6V |
| Operating temperature | -40°C ~ 105°C (TA) |
| Speed | 180MHz |
| Package | Tray |
| RAM size | 104K x 8 |
| Core size | 32-Bit Single-Core |
| EEPROM size | 16K x 8 |
| Peripherals | Brown-out Detect/Reset, DMA, I2S, POR, WDT |
| Connectivity | CANbus, EBI/EMI, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART |
| Number of i (O) | 49 |
| Core processor | ARM® Cortex®-M3 |
| Case | 100-TFBGA |
| Data converters | A/D 4x10b; D/A 1x10b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
What package is the LPC1812JET100E, and can it be hand-soldered?
100-TFBGA (9×9 mm, 100-ball), surface-mount in tray. This is a BGA package — it requires paste printing and reflow; it is not hand-solderable. Ball-collapse and pad-trap dimensions for process qualification are in the NXP datasheet, not the distributor record.
What is the supply voltage and temperature rating?
2.2 to 3.6V single supply; -40 to 105°C operating temperature — industrial grade, suitable for embedded IO modules and motor-drive environments.