NXP LPC1778FET180,551 — 120MHz ARM Cortex-M3 MCU, 512KB Flash, 180-TFBGA
NXP LPC17xx series ARM Cortex-M3 MCU, LPC1778FET180,551, 120MHz, 512KB Flash, 96KB SRAM, Ethernet, USB OTG, CAN, 141 I/O, 2.4–3.6V, -40°C–85°C, 180-TFBGA package.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Series | LPC17xx |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 2.4V ~ 3.6V |
| Operating temperature | -40°C ~ 85°C (TA) |
| Speed | 120MHz |
| Package | Tray |
| RAM size | 96K x 8 |
| Core size | 32-Bit Single-Core |
| EEPROM size | 4K x 8 |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT |
| Connectivity | CANbus, EBI/EMI, Ethernet, I²C, Microwire, Memory Card, SPI, SSI, SSP, UART/USART, USB OTG |
| Number of i (O) | 141 |
| Core processor | ARM® Cortex®-M3 |
| Case | 180-TFBGA |
| Data converters | A/D 8x12b; D/A 1x10b |
| Program memory size | 512KB (512K x 8) |
Frequently asked questions
Does the LPC1778 support pre-validated EtherCAT or Profinet stacks, or is firmware custom?
The LPC1778FET180,551 has on-chip Ethernet, CAN, USB OTG, and SPI/SSP ports, but no pre-validated or certified EtherCAT slave stack or Profinet IRT profile is built into the silicon. Ethernet and fieldbus protocol firmware is written by the developer or sourced from a third-party stack vendor — it is not a turnkey protocol-enabled MCU out of the box.
What is the minimum order quantity and is allocation a risk on typical panel-build schedules?
The LPC1778FET180,551 ships in tray packaging. Minimum order quantity and any allocation windows are quote-driven — submit an RFQ with your panel-build schedule to get a confirmed availability and lead time against your required quantities.
Can the 180-TFBGA be reworked on a production panel without X-ray?
Hot-air rework of a 180-ball 0.5mm-pitch TFBGA is feasible with flux, bottom-side preheat, and a calibrated hot-air station — but X-ray inspection after rework is the only way to confirm joint integrity under the chip without decapsulating the part. The lack of a pin-1 orientation marking on the package silkscreen means the PCB footprint must carry the marking clearly before rework begins. Production-panel rework of this BGA density is a skilled-operation decision, not a routine field swap.
Can the LPC1778FET180,551 substitute directly for an older LPC2138 in an existing LQFP design?
No — the LPC1778FET180,551 uses a 180-TFBGA package with a different pinout and footprint compared to the LQFP variants in the LPC2138 family, and it operates at 2.4–3.6V rather than the 5V rail the LPC2138 uses. The substitution requires PCB redesign, not just a part swap. Refer to the NXP LPC1778 datasheet and the LPC2138 reference schematics to evaluate a full redesign scope.