NXP LPC1765FET100K ARM Cortex-M3 MCU, 100MHz, 256KB Flash, 100-TFBGA
NXP LPC17xx series, LPC1765FET100K, 32-bit ARM Cortex-M3 100MHz, 256KB Flash, 64KB RAM, 70 GPIO, 2.4–3.6V, -40 to 85°C, 100-TFBGA (9×9mm) tray.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
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- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
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Specifications
| Parameter | Value |
|---|---|
| Series | LPC17xx |
| Mounting type | Surface Mount |
| Oscillator type | Internal |
| Program memory type | FLASH |
| Voltage - supply (Vcc (Vdd)) | 2.4V ~ 3.6V |
| Operating temperature | -40°C~85°C(TA) |
| Speed | 100MHz |
| Package | Tray |
| RAM size | 64K x 8 |
| Core size | 32-Bit Single-Core |
| Peripherals | Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT |
| Connectivity | CANbus, I²C, IrDA, Microwire, SPI, SSI, SSP, UART/USART, USB OTG |
| Number of i (O) | 70 |
| Core processor | ARM® Cortex®-M3 |
| Case | 100-TFBGA |
| Data converters | A/D 8x12b SAR |
| Program memory size | 256KB (256K x 8) |
Frequently asked questions
What is the lifecycle status of the LPC1765FET100K?
NXP lists the LPC1765FET100K as Active with ROHS3 compliance. There is no L* successor order code in this ledger, and no published PCN or EOL notice is shown here. For production-run planning, an RFQ confirms current allocation and lead time.
Is the LPC1765FET100K pin-compatible with the LPC1766 or LPC1768?
All three are in the NXP LPC17xx family and share the same 100-TFBGA package with 0.65mm ball pitch, but pin compatibility and boot-loader differences must be verified against NXP's official cross-reference or datasheet before substituting. This ledger carries no cross-reference entry; do not treat family membership as a confirmed drop-in.
Does the 100-TFBGA package need a thermal pad or thermal vias for typical industrial enclosure ambients?
The 100-TFBGA has no exposed thermal pad; thermal resistance is junction-to-ambient through the PCB via field. For TA up to 85°C the part is rated for continuous operation, but at enclosure ambients above 75°C with USB OTG active, the thermal margin narrows — thermal vias under the device are good practice, not optional margin.