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Microchip Technology MIC2019A-2YM6-TR — Signal Isolation

MIC2019A-2YM6-TR Power Switch, 170mOhm, 900mA, SOT-23-6

MPNMIC2019A-2YM6-TR
End of Life

Microchip MIC2019A-2YM6-TR, General Purpose High-Side Power Switch, P-Channel, 1:1, 170mOhm Rds(on), 900mA, SOT-23-6, -40°C to 85°C.

$0.63Ref. price · indicative, final on quote
PackagingSOT-23-6
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

MIC2019A-2YM6-TR Technical Specifications
ParameterValue
Input typeNon-Inverting
Output typeP-Channel
Switch typeGeneral Purpose
Mounting typeSurface Mount
Voltage - load2.5V ~ 5.5V
Voltage - supply (Vcc (Vdd))Not Required
Current - output900mA
Number of outputs1
InterfaceOn/Off
Operating temperature-40°C ~ 85°C (TA)
PackageTape & Reel (TR); Cut Tape (CT)
Rds on170mOhm
CaseSOT-23-6
Fault protectionCurrent Limiting (Adjustable), Over Temperature
Output configurationHigh Side
Ratio - Input:Output1:1

Product details

Active high-side switch in a rework-friendly SOT-23-6

The MIC2019A-2YM6-TR: The non-inverting input and P-channel output configuration simplify drive logic — a logic high on the On/Off control pin turns the switch on without requiring an external Vcc supply, as the device is self-powered from the load rail.

The 170 mOhm typical Rds(on) at 5 V gate drive translates to about 140 mV drop at 900 mA and roughly 130 mW of conduction loss — manageable in the SOT-23-6 package if the PCB copper is adequate, but at the upper end of the thermal budget at 85°C ambient without airflow.

SOT-23-6 — hand-reworkable, but watch the pad

The SOT-23-6 package is small enough for hand rework with hot air, but the exposed pad (if present on the actual die-attach) is not always visible — the part has a single thermal pad on the bottom that should be soldered to a copper land on the PCB for best heat transfer. Pin 1 orientation is marked by a dot on the top of the package; verify the footprint matches the supplier device package drawing before layout.