MCP609-I/P

Microchip Technology

Microchip MCP609-I/P quad CMOS rail-to-rail op-amp, 155 kHz gain bandwidth, 0.08 V/µs slew rate, 2.5 V to 6 V supply, 18.7 µA supply current, 250 µV offset, 1 pA input bias, 14-DIP through-hole package, -40°C to +85°C.

Microchip Technology MCP609-I/P
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Technical specifications

MCP609-I/P specifications
Parameter / AttributeSpecification / Value
Output typeRail-to-Rail
MountingThrough Hole
Amplifier typeCMOS
Voltage - input offset250 µV
Voltage - supply span2.5 V
Current - supply18.7µA (x4 Channels)
Current - input bias1 pA
Current - output (Channel)17 mA
Operating temperature-40°C ~ 85°C (TA)
Gain bandwidth product155 kHz
PackageTube
Slew rate0.08V/µs
Case14-DIP (0.300\", 7.62mm)
Number of circuits4

Technical details

The MCP609-I/P is a quad CMOS rail-to-rail output op-amp from Microchip, in a 14-pin DIP package. Its 155 kHz gain-bandwidth product and 0.08 V/µs slew rate place it firmly in the micropower, low-frequency signal-conditioning space — think thermocouple amplifiers, battery-voltage monitors, and piezo-sensor buffers where the signal bandwidth stays under a few kilohertz. The 18.7 µA total supply current (four channels) means each amplifier draws under 5 µA, making this a natural fit for loop-powered 4-20 mA transmitters or battery-backed sensor nodes that run for years on a coin cell.

Rail-to-rail output, CMOS input — where the limits live

The CMOS input stage gives 1 pA typical input bias current, so you can use high-value feedback resistors (1 MΩ or more) without offset drift from bias current.

Supply range and package — breadboard to production

The supply span runs from 2.5 V minimum to 6 V maximum, covering single-cell Li-ion (3.0 V to 4.2 V) and standard 5 V logic rails. For production, the through-hole package limits automated assembly speed compared to SOIC or TSSOP, but for low-volume, high-reliability or breadboard-first designs the DIP is still the practical choice.

MCP609-I/P
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