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Microchip Technology M2GL025-VFG256 — Memory (DRAM / SRAM / Flash / EEPROM)

Microchip M2GL025-VFG256 IGLOO2 FPGA, 27696 LEs, 138 I/O

MPNM2GL025-VFG256
End of Life

Microchip IGLOO2 series, M2GL025-VFG256, FPGA, 27696 logic elements/cells, 1130496 total RAM bits, 138 I/O, 1.14V-2.625V supply, 0°C-85°C, 256-LFBGA, surface mount.

$65.87Ref. price · indicative, final on quote
Packaging256-LFBGA
StockContact for availability
MOQ1 pcs
  • 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
  • Date & lot codes on quoteStated per line before you commit; label photos on request.
  • MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
  • PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.

Specifications

M2GL025-VFG256 Technical Specifications
ParameterValue
SeriesIGLOO2
Mounting typeSurface Mount
Voltage1.14V ~ 2.625V
Operating temperature0°C ~ 85°C (TJ)
PackageTray
Number of i (O)138
Case256-LFBGA
Total RAM bits1130496
Number of logic elements (Cells)27696

Product details

What the 27696 logic elements buy you

The Microchip M2GL025-VFG256 is an IGLOO2 FPGA with 27696 logic elements and 1130496 bits of embedded RAM, packaged in a 256-LFBGA (14x14 mm FPBGA). That logic count sits in the mid-range of the IGLOO2 family — enough to absorb a 32-bit soft-core processor, some DSP datapath, and a handful of peripheral controllers without needing a larger die. The 138 I/O give you room to bring out a parallel bus, multiple SPI/UART interfaces, and still have pins left for board-level control signals. Supply voltage spans 1.14 V to 2.625 V, which means this part can live on a 1.2 V core rail or a 2.5 V auxiliary rail without an extra regulator — useful when you're trying to simplify the power tree on a mixed-voltage board.

Package reality — 256-ball BGA on a 14x14 mm footprint

The 256-LFBGA (fine-pitch BGA) with a 14x14 mm body is a hand-placeable package for a rework station, but the 0.8 mm ball pitch means you need a decent microscope and a profile that doesn't soak the part past 260 °C peak. The supplier device package is 256-FPBGA (14x14) — same footprint, same ball map. Surface-mount only, no socket option. If you're doing a prototype run, budget for a stencil and a pre-bake if the tray has been open past the MSL floor life. The 138 I/O are distributed around the perimeter balls, not a depopulated center — so fanout via microvias is straightforward on a 4-layer board.

That's commercial/industrial floor — fine for benchtop instruments, telecom indoor equipment, and most factory automation cabinets that aren't sitting next to an oven. Not rated for under-hood automotive or outdoor pole-mount enclosures without active cooling. If your design lives in a conditioned space, this grade is exactly what you want; if the ambient hits 90 °C, you'll need the industrial-temperature variant (the M2GL025-FCSG325I sibling, which runs -40 °C to 100 °C).

Lifecycle — still in active production

No last-time-buy notice, no end-of-life warning. The ROHS3 compliance means it ships fully lead-free — no exemption for tin-lead finish, so verify your reflow profile handles pure tin balls.

Frequently asked questions

Is M2GL025-VFG256 RoHS compliant?

Yes, the M2GL025-VFG256 is ROHS3 compliant, meaning it meets the EU RoHS directive with no exempted lead content in the solder balls or plating.