The Microchip M2GL025-FCSG325I is an IGLOO2 family FPGA packing 27696 logic elements and 1130496 bits of embedded SRAM in a 325-ball FCBGA package. It gives you 180 user I/O and a supply range from 1.14V to 2.625V, which covers the common 1.2V and 1.5V core rails plus 1.8V and 2.5V I/O banks without extra regulators.
This is a 325-ball TFBGA/FCBGA, 11x11 mm body, surface-mount only. The 0.5 mm ball pitch means a standard BGA rework station with a preheater and a fine-nozzle hot-air pencil can handle it, but the 180 I/O fan out under the package — no peripheral leads — so you need a good X-ray to verify solder joints after reflow. No exposed pad, so thermal dissipation goes through the BGA balls into the board — a 4-layer PCB with a solid ground plane under the footprint is the minimum for reliable operation at the top end of the temperature range.
Lifecycle — still in active production, no LTB watch
Microchip lists the M2GL025-FCSG325I as Active. That means no last-time-buy notice, no end-of-life clock ticking.