1M gate ProASIC3 — logic capacity and I/O count for the BOM
The Microchip A3P1000-FGG256I is a ProASIC3 nonvolatile FPGA offering 1,000,000 system gates and 177 user I/O in a 256-ball FBGA package. The 147456 total RAM bits provide on-chip block memory for FIFOs and small buffers without external SRAM. The 1.425V core supply and surface-mount 256FBGA footprint place it in the mid-density ProASIC3 tier — a fit for designs that need a single-chip logic fabric without a separate configuration PROM.
The 'I' suffix in the order code flags the industrial temperature grade — the commercial-grade sibling (no suffix) is limited to 0°C to 85°C.
Package and supply — 256FBGA, 1.425V core
The 256-ball FBGA (Fine-pitch Ball Grid Array) requires a 4-layer or more PCB for fan-out of the 177 I/O. Core voltage is 1.425V nominal; I/O banks can be configured for 1.5V, 1.8V, 2.5V, or 3.3V depending on the bank supply pins.