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Microchip Technology A3P1000-FG144I — FPGA / CPLD & Programmable Logic

Microchip A3P1000-FG144I ProASIC3 FPGA, 1M Gates, 97 I/O

MPNA3P1000-FG144I
Active

Microchip ProASIC3 FPGA, A3P1000-FG144I, 1M system gates, 147456 bits RAM, 97 user I/O, 1.425 V core, -40°C to 100°C junction, 144-ball FBGA tray.

$93.56Ref. price · indicative, final on quote
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Specifications

A3P1000-FG144I Technical Specifications
ParameterValue
SeriesProASIC3
Mounting_typeSurface Mount
Operating temperature high-40°C to 100°C (TJ)
Package_typeTray
Number of i (O)97
Total ram bits147456
Product_statusActive
Number of gates1000000
Supply_voltage_v1.425

Product details

1M-gate ProASIC3 FPGA in 144-ball FBGA

The Microchip A3P1000-FG144I is a nonvolatile flash-based FPGA from the ProASIC3 family, offering 1 million system gates with 147456 bits of embedded RAM in a 144-ball FBGA package. It provides 97 user-configurable I/O pins and operates from a single 1.425 V core supply, simplifying the power delivery network compared to multi-rail FPGAs.

Flash FPGA: instant-on, no external boot memory

Because the configuration is stored in on-chip flash cells, the A3P1000-FG144I powers up and is operational in microseconds — no external SPI flash or configuration PROM is needed, and there is no configuration bitstream to manage during production. The 147456 bits of total RAM are distributed as block RAM across the fabric, sized for FIFO buffers, small packet caches, or coefficient storage in DSP chains. With 1 million system gates, this part fits medium-density glue logic consolidation, display controllers, or sensor fusion pre-processing — not the multi-million-gate class of a Kintex or Stratix, but a solid fit where deterministic timing and single-chip operation matter.

Industrial temperature and supply margins

Core supply is 1.425 V nominal — a clean 1.5 V rail with 5% tolerance keeps the core within spec; the I/O banks tolerate 3.3 V, 2.5 V, and 1.8 V standards, though the exact Vccio assignments depend on the bank mapping in the Libero design suite. The 144-ball FBGA footprint uses a 0.80 mm ball pitch — a 4-layer PCB with via-in-pad or microvias is the practical floor for fan-out; two-layer boards will struggle to route all 97 I/O plus power and ground.

The ProASIC3 family has been in production for over a decade; the flash process is mature, and Microchip continues to support it alongside the newer IGLOO2 and PolarFire families for designs that need the instant-on, single-chip flash architecture.

Frequently asked questions

How many I/O pins does the A3P1000-FG144I provide?

It has 97 user-configurable I/O pins in the 144-ball FBGA package. The remaining balls are dedicated to power, ground, and configuration functions.

What is the difference between the A3P1000-FG144I and the A3P1000-FG144?

All other specifications — gate count, RAM, I/O count, package — are identical.