Thermal and mechanical fit for reflow assembly
The 1.5SMC530A: The SMC footprint is standard for 1500 W TVS diodes; the large copper pad on the cathode side (the tab) should be soldered to a thermal via array on the PCB to keep the junction below 150°C during a 10/1000 µs pulse at rated power.
For BOM planning, the 1.5SMC series includes multiple standoff voltages in the same DO-214AB footprint, so a last-minute voltage change does not require a board spin.
