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Littelfuse Inc. 5KP20CA — Circuit Protection

Littelfuse 5KP20CA TVS Zener, 5kW Peak Pulse

MPN5KP20CA
Active

Littelfuse 5KP20CA Zener TVS diode, 5kW peak pulse, 20V standoff, 22.2V min breakdown, 32.4V max clamping at 157.4A. Bidirectional single-channel, P600 axial through-hole, -55°C to 175°C junction.

$2.7300Ref. price · indicative, final on quote
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

5KP20CA specifications
ParameterValue
TypeZener
Series5KP
MountingThrough Hole
Voltage - breakdown22.2V
Voltage - clamping (Max) @ ipp32.4V
Voltage - reverse standoff20V
Current - peak pulse (10/1000μs)157.4A
Power - peak pulse5000W (5kW)
Power line protectionNo
Operating temperature-55°C ~ 175°C (TJ)
PackageTape & Reel (TR) Cut Tape (CT)
ApplicationsGeneral Purpose
CaseP600, Axial
Bidirectional channels1

Product details

What 5 kW peak pulse means for let-through voltage

The 5KP20CA: The 157.4 A surge current rating is what gives this part enough headroom to protect most low-voltage rail systems without collapsing into conduction before the clamp engages.

Breakdown and clamping — the voltage chain

The reverse standoff voltage is 20 V typical — the working rail the TVS sees in normal operation. Minimum breakdown sits at 22.2 V, so the device does not turn on prematurely at the rail voltage. When a transient exceeds that threshold, the clamp limits the peak to 32.4 V, giving a clamping ratio of roughly 1.6× over the standoff — tight enough to protect sensitive circuits without excessive let-through.

Bidirectional single-channel operation means it clamps both polarities from one part — no need to stack two unidirectional devices.

P600 axial through-hole package

The P600 axial package mounts through-hole on a PCB, which simplifies board assembly and gives a robust leaded form factor for environments where vibration or thermal cycling stresses surface-mount solder joints. The Tape & Reel and Cut Tape packaging options support both high-volume assembly and low-quantity prototyping runs.