The 1.5SMC36AT3G: No official successor or pin-compatible replacement is recorded in the available documentation. For a BOM line that requires this exact clamp voltage and package, the only path is through surplus or broker inventory. A board-level redesign to a currently active TVS with similar electrical characteristics may be the more sustainable option for new builds.
The DO-214AB (SMC) package has a standard JEDEC footprint with a cathode band on the body. The large copper pad on the PCB under the device aids thermal dissipation during a pulse event. Surface-mount assembly follows standard reflow profiles for SMC packages; no special handling beyond normal ESD precautions is required.