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Infineon Technologies TC265D40F200WBCKXUMA1 — Microcontrollers & Processors (MCU / MPU / DSP)

Infineon TC265D40F200WBCKXUMA1 AURIX MCU, 200MHz, 176-LQFP

MPNTC265D40F200WBCKXUMA1
End of Life

Infineon Technologies AURIX™ 32-bit Dual-Core TriCore™ microcontroller, TC265D40F200WBCKXUMA1, 200MHz, 2.5MB Flash, 240K x 8 RAM, 96K x 8 EEPROM, 176-LQFP Exposed Pad, -40°C to 125°C.

$36.84Ref. price · indicative, final on quote
Packaging176-LQFP Exposed Pad
RoHSROHS3 Compliant
SeriesAURIX™
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

TC265D40F200WBCKXUMA1 specifications
ParameterValue
SeriesAURIX™
MountingSurface Mount
Oscillator typeExternal
Program memory typeFLASH
Voltage - supply (Vcc (Vdd))3.3V, 5V
Operating temperature-40°C ~ 125°C (TA)
Speed200MHz
PackageTape & Reel (TR); Cut Tape (CT)
RAM size240K x 8
Core size32-Bit Dual-Core
EEPROM size96K x 8
PeripheralsDMA, WDT
ConnectivityASC, CANbus, Ethernet, FlexRay, HSSL, I2C, LINbus, MSC, PSI5, QSPI, SENT
Number of i (O)112
Core processorTriCore™
Case176-LQFP Exposed Pad
Data convertersA/D 50x12b, 3 x Sigma-Delta
Program memory size2.5MB (2.5M x 8)

Product details

176-pin LQFP with exposed pad — thermal and layout considerations

The TC265D40F200WBCKXUMA1: The pad carries the bulk of the junction-to-board heat path — the 0.5 mm pitch perimeter leads alone cannot sink the full dissipation of a 200 MHz dual-core TriCore running both cores flat out. The 176-lead count with 112 I/O means at least four signal layers are advisable for fan-out — two-layer boards will struggle to route the peripheral set.

Dual-core TriCore architecture — safety and performance domains

Two 32-bit TriCore cores running at 200 MHz each give the TC265D40F200WBCKXUMA1 the headroom to split a real-time control loop from a safety-monitoring task without a second chip. One core can execute the application control algorithm while the other runs the diagnostic software layer — a common pattern in ASIL-B and ASIL-D systems. The 2.5 MB on-chip flash and 240 KB RAM cover most powertrain, transmission, and ADAS sensor-fusion firmware images without external memory. The 96 KB EEPROM block stores calibration and fault-log data that survives power cycles.

Vehicle-domain connectivity — Ethernet, FlexRay, CAN, PSI5, SENT

The peripheral set covers every major automotive serial bus: CANbus (multiple nodes), FlexRay for deterministic chassis control, Ethernet for high-bandwidth diagnostics or OTA updates, LINbus for low-cost body nodes, and the sensor-specific PSI5 and SENT interfaces for airbag and pressure-sensor arrays. The HSSL (High-Speed Serial Link) provides a 80 Mbit/s point-to-point channel between AURIX devices in a multi-MCU system. The 50-channel 12-bit ADC and three sigma-delta converters can sample current, voltage, and position signals from multiple sensors simultaneously — enough analog front-end for a six-phase motor controller reading phase currents, DC bus voltage, and resolver feedback on the same device.

Active lifecycle and sourcing posture

Infineon lists the TC265D40F200WBCKXUMA1 as Active (current production) with ROHS3 compliance. Sourced through authorized and independent distribution channels; pricing and lead time are confirmed at RFQ against the BOM quantity.

Frequently asked questions

What is the closest functional second-source for TC265D40F200WBCKXUMA1?

The XMC4800F100F1024AAXQMA1 (ARM Cortex-M4, 144 MHz) is a different architecture — the TC265D40F200WBCKXUMA1 uses a dual-core TriCore, not ARM. A board designed around the AURIX TC265 cannot drop in the XMC4800 without a firmware rewrite and possibly a PCB change due to different pinout and peripheral maps.

What compliance documentation does Infineon provide for TC265D40F200WBCKXUMA1?

Infineon certifies ROHS3 compliance for this part. The standard compliance package includes the RoHS certificate of compliance and the REACH declaration.