55 V, 30 A N-channel HEXFET in a TO-262 through-hole package
The TO-262 (I²Pak) through-hole package with long leads suits designs where the device is bolted to a heatsink or mounted on a PCB with a thermal pad.
The gate threshold voltage is 2 V maximum at 250 µA drain current, making it a logic-level device that can be driven directly from 5 V or 3.3 V logic outputs. The drive voltage range for achieving minimum on-resistance is 4 V to 10 V. Input capacitance is 880 pF at 25 V drain-source, which influences switching speed and driver sizing.
Buyers should verify stock position before committing a BOM line; this is a part to procure on a per-order basis rather than blanket into a production forecast.
Thermal and power dissipation
Maximum power dissipation is 3.8 W at ambient (25°C) and 68 W at case temperature (25°C). The wide gap between Ta and Tc ratings underscores the need for effective heatsinking when running more than a few watts.
