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Infineon Technologies IRF640NSPBF — Discrete Semiconductors

IRF640NSPBF HEXFET N-Channel MOSFET, 200 V, 18 A, D2PAK

MPNIRF640NSPBF
End of Life

Infineon IRF640NSPBF HEXFET® N-Channel MOSFET, 200 V Vdss, 18 A continuous drain, 150 mΩ Rds(on) at 10 V, D2PAK (TO-263) surface mount, -55 to 175°C junction temperature.

$1.2700Ref. price · indicative, final on quote
Independent supplier — new & surplus stockAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

IRF640NSPBF specifications
ParameterValue
SeriesHEXFET®
FET typeN-Channel
MountingSurface Mount
Drain to source voltage200 V
Drive voltage (Max rds on, min rds on)10V
Current - continuous drain (Id) @ 25°C18A (Tc)
Power dissipation150W (Tc)
Operating temperature-55°C~175°C(TJ)
PackageTube
Vgs±20V
TechnologyMOSFET (Metal Oxide)
CaseTO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Vgs(th) (Max) @ id4V @ 250µA
Rds on (Max) @ id, vgs150mOhm @ 11A, 10V
Gate charge (Qg) (Max) @ vgs67 nC @ 10 V
Input capacitance (Ciss) (Max) @ vds1160 pF @ 25 V

Product details

200 V, 18 A — what this HEXFET handles

That 200 V rating puts it solidly into 48 V bus systems, 72 V battery packs, and telecom rectifiers where you need headroom above a 48 V rail. Gate charge is 67 nC at 10 V, which is moderate for this current class. A standard gate-driver IC like a TC4427 or a half-bridge driver can switch it at tens of kHz without the drive losses eating your efficiency margin. Input capacitance is 1160 pF at 25 V drain — that tells you the switching speed is manageable for a 200 V part.

Temperature range and package — field-fit check

That means this part can sit in an engine bay, a downhole tool, or an outdoor telecom cabinet where the ambient hits 85°C and the junction climbs higher. The 175°C limit gives you thermal margin that a 150°C part would not. Package is D2PAK (TO-263-3), a surface-mount power package with a large exposed drain tab. That tab is the drain connection, so the PCB copper pour under the part is at drain potential — layout needs to keep that clear of ground pour unless the design calls for it. The tab carries most of the heat; without a good via-stitch to inner-layer copper, the 150 W power dissipation rating is theoretical. For a field swap, this is a reflow-only part — no socket, no hand-solder in the parking lot.

Gate drive and threshold — what to watch

The gate is rated ±20 V max, so you have headroom for a clean 10 V drive without worrying about oxide punch-through.

For production BOMs, it is a stable line item — no need to stockpile or hunt for an alternate yet.

Frequently asked questions

Is IRF640NSPBF a direct replacement for IRF640?

The IRF640NSPBF is the surface-mount D2PAK version of the through-hole IRF640. The die is the same HEXFET technology, same 200 V / 18 A ratings, same gate charge. If your board uses the TO-220 IRF640, the NSPBF variant will not drop in — the footprint and thermal path are different. For a new design or a respin, you can use the same electrical design and swap the package.

Is IRF640NSPBF RoHS compliant?

The part number suffix 'PBF' indicates lead-free (RoHS-compliant) plating. The IRF640NSPBF is the lead-free version of the IRF640NS. No separate RoHS certificate is needed for this suffix — it is the standard RoHS-compliant offering from Infineon.