100 V, 33 A N-channel HEXFET in D2PAK
The 175°C maximum junction gives headroom for high-current operation with adequate heatsinking.
Supplied in a D2PAK (TO-263-3) surface-mount package with two leads and a tab. The D2PAK footprint is standard for 30–50 A class MOSFETs and allows reflow assembly alongside other SMD components.
Infineon lists the IRF540NSTRRPBF as obsolete.
