Infineon CY7C2563XV18-633BZXC 72Mbit QDR II+ SRAM, 633 MHz, 1.7V
MPNCY7C2563XV18-633BZXC
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Infineon CY7C2563XV18-633BZXC, 72Mbit synchronous QDR II+ SRAM, 4M x 18 organization, 633 MHz parallel interface, 1.7 V supply, 165-FBGA (13x15) tray, 0°C to 70°C.
$392.6900Ref. price · indicative, final on quote
StockContact for availability
MOQ1 pcs
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Memory type | Volatile |
| Mounting type | Surface Mount |
| Voltage | 1.7V ~ 1.9V |
| Frequency | 633 MHz |
| Memory interface | Parallel |
| Operating temperature | 0°C ~ 70°C (TA) |
| Package | Tray |
| Technology | SRAM - Synchronous, QDR II+ |
| Memory size | 72Mbit |
| Memory format | SRAM |
| Case | 165-LBGA |
| Memory organization | 4M x 18 |
Frequently asked questions
Does the CY7C2563XV18-633BZXC share the same 165-FBGA pad layout as the CY7C2568XV18-633BZXC, and do I need a layout spin?
Both parts are 165-FBGA with the same 13×15 mm body and ball pitch — the pad layout and solder mask openings are family-consistent. A layout spin is not required if the existing gerber targets the Infineon 165-FBGA footprint standard. The only operational difference is packaging: CY7C2563XV18-633BZXC ships in tray; CY7C2568XV18-633BZXC ships in bulk — verify your assembly feeder or tray-jig setup matches the incoming pack.