CY7C1512KV18-333BZXI Cypress 72Mbit QDR-II SRAM, 333MHz, 165-FBGA
Cypress CY7C1512KV18-333BZXI, a 72Mbit Synchronous QDR-II SRAM organized 4M x 18, clocked at 333 MHz, operating from 1.7V to 1.9V, surface-mount 165-LBGA/FBGA package, rated -40°C to 85°C.
- 100% new & originalTraceable channels only — no refurbs, no pulls, no remarked parts.
- Date & lot codes on quoteStated per line before you commit; label photos on request.
- MSL-compliant ESD packingMoisture-sealed bags with indicator cards; reels photo-verified.
- PayPal buyer protectionPay by T/T, PayPal or Payoneer — card payments covered end to end.
Specifications
| Parameter | Value |
|---|---|
| Memory type | Volatile |
| Mounting type | Surface Mount |
| Voltage | 1.7V ~ 1.9V |
| Frequency | 333 MHz |
| Memory interface | Parallel |
| Operating temperature | -40°C ~ 85°C (TA) |
| Package | Bulk |
| Technology | SRAM - Synchronous, QDR II |
| Memory size | 72Mbit |
| Memory format | SRAM |
| Case | 165-LBGA |
| Memory organization | 4M x 18 |
Frequently asked questions
Can I substitute the CY7C1512KV18-250BZC (commercial 0°C to 70°C) for the 333BZXI on the same board layout?
The package footprint is the same, but the 333BZXI carries a -40°C to 85°C industrial temperature rating that the 250BZC does not. If the end environment is industrial or outdoor, or the procurement spec requires an industrial grade, the BZXI part is the correct line item. The 250BZC may function in a benign thermal environment, but that is a design decision, not a guaranteed drop-in swap.
Does the 333BZXI share the same pinout and package footprint as the 250BZC?
The physical footprint is the same 165-FBGA (13×15 mm) with the same ball count and pitch. However, the 333 MHz speed grade introduces signal-integrity constraints — controlled-impedance traces and byte-lane length matching — that the 250 MHz variant does not require to the same degree. A board validated at 250 MHz cannot simply be stuffed with the 333BZXI without re-qualification of the memory interface.