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Infineon Technologies CY27H256-25ZC — Discrete Semiconductors

Infineon CY27H256-25ZC UV EPROM, 256Kbit, 25 ns, 28-TSOP I

MPNCY27H256-25ZC
End of Life

Infineon Technologies CY27H256-25ZC UV EPROM, 256Kbit (32K x 8), 25 ns access time, Parallel interface, 4.5V-5.5V supply, 0°C to 70°C, 28-TSOP I package, Bulk.

$5.74Ref. price · indicative, final on quote
Packaging28-TSSOP (0.465", 11.80mm Width)
RoHSRoHS non-compliant
Sourced new & surplus through independent channelsAuthenticity-screened · ESD-safe packingListing updated Aug 2026

Specifications

CY27H256-25ZC specifications
ParameterValue
Memory typeNon-Volatile
MountingSurface Mount
Voltage4.5V ~ 5.5V
Memory interfaceParallel
Operating temperature0°C ~ 70°C (TA)
PackageBulk
TechnologyEPROM - UV
Access time25 ns
Memory size256Kbit
Memory formatEPROM
Case28-TSSOP (0.465\", 11.80mm Width)
Memory organization32K x 8

Product details

25 ns access UV EPROM for legacy 5V firmware storage

The CY27H256-25ZC is a 256Kbit UV-erasable EPROM organized as 32K x 8 bits, with a 25 ns maximum access time. The 25 ns access time sets the read-cycle window for the host CPU or logic — the memory must present valid data within that window from address assertion, which constrains bus timing margins in legacy 5V processor designs.

UV-EPROM technology and package

This device uses UV-EPROM technology, meaning the die is erased by exposure to ultraviolet light through a quartz window in the package. In production, the device is programmed once and treated as a one-time-programmable (OTP) memory — field erasure requires a UV eraser and is practical only during development or rework. The 28-TSOP I package (0.465" body width, 11.80 mm) is a surface-mount thin small-outline package. The windowed variant allows UV erasure; the non-windowed OTP version is a separate order code. The 28-TSOP I footprint is standard for byte-wide EPROMs of this era and density. The commercial temperature grade (0°C to 70°C) limits deployment to indoor, temperature-controlled environments — not suitable for industrial or automotive ambient extremes without additional qualification data.

Active lifecycle and compliance note

RoHS non-compliant (lead-bearing construction). This is typical for UV-EPROM devices that use a windowed ceramic or plastic package with a lead-frame finish that does not meet the RoHS exemption sunset. Designs requiring RoHS compliance should evaluate the non-windowed OTP variant or a serial-flash migration path.