Specs side by side
2 parts compared · 26 differing specs across 26 total parameters.
| Parameter | ||
|---|---|---|
| Operating temperature | - | -40°C~85°C(TA) |
| Supply voltage | 2.6V – 3.6V | - |
| Voltage - Supply (vcc (vdd)) | - | 1.8V ~ 3.6V |
| Memory & Peripherals | 512 KB Flash, 192 KB SRAM, 10/100 Ethernet MAC, USB OTG, 2x CAN 2.0B, FSMC | - |
| Program Memory Size | - | 512KB (512K x 8) |
| Program Memory Type | - | FLASH |
| Ram Size | - | 192K x 8 |
| Case | LQFP-100 | 100-LQFP |
| Package | - | Tray |
| Compatibility Level | 100% Drop-in (Zero Code Change) | - |
| Connectivity | - | CANbus, DCMI, EBI/EMI, Ethernet, I²C, IrDA, LINbus, SPI, UART/USART, USB OTG |
| Core & Architecture | ARM Cortex-M4 with FPU @ 168 MHz (up to 200 MHz on rev B) | - |
| Core Processor | - | ARM® Cortex®-M4 |
| Core Size | - | 32-Bit Single-Core |
| Data Converters | - | A/D 16x12b; D/A 2x12b |
| Firmware Notes | Pinout, register base addresses, and peripheral bit mappings align with STM32F407. Ethernet PHY MII/RMII interface timings and FSMC memory controller timings are pin-identical. Update IDE Flash loader algorithm for GD32. | - |
| Hardware Notes | Direct solder drop-in on existing 100-pin LQFP footprint. Decoupling capacitor values and VDD/VSS/VBAT routing require zero PCB modification. | - |
| Lead Time Advantage | Immediate Stock (24–48h Dispatch) | - |
| Mounting | - | Surface Mount |
| Number Of I (o) | - | 82 |
| Oscillator Type | - | Internal |
| Peripherals | - | Brown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDT |
| Reference Part | STM32F407VET6 | - |
| Series | - | STM32F4 |
| Sourcing Advantage | Continuous high-volume production with verified traceable factory reels in Shenzhen. | - |
| Speed | - | 168MHz |
Parts
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